CMP, Often called thermal oxidation polishing, makes use of MP along with chemical substances to boost the MRR and boost surface high quality [twenty]. Determine 2 illustrates the schematic of a typical CMP process [21]. The SiC wafer, that is fixed within the provider, and also the sharpening pad transfer https://www.pinterest.com/pin/1001488035878243572/
Thermal expansion coefficient of silicon carbide - An Overview
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